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bondline integrity monitoring
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Select article: Integrity monitoring of adhesively bonded joints via an electromechanical impedance-based approach
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Research article
First published September, 2018
Integrity monitoring of adhesively bonded joints via an electromechanical impedance-based approach
Yitao Zhuang,
Fotis Kopsaftopoulos,
Roberto Dugnani
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Structural Health Monitoring
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Select article: Monitoring adhesive integrity of disk-shaped transducer by electromechanical impedance
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First published October, 2013
Monitoring adhesive integrity of disk-shaped transducer by electromechanical impedance
Roberto Dugnani
Journal of Intelligent Material Systems and Structures
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