Studies on thermal degradation kinetics and dielectric properties of polyether imide foam/nanosilica-based nanocomposites

In this paper, polyether imide (PEI) having properties such as a high glass transition temperature of 216°C, high heat resistance, high flame resistance, low smoke generation and a high melting point within the range of 400°C, having low thermal conductivity and low dielectric constant was chosen to be a polymeric foam. Water vapor-induced phase separation method was used to prepare PEI foams. PEI foams were reinforced with nano-silica (weight 1, 3 and 5%) in order to alter the dielectric properties, thermal conductivity and degradation kinetics of foamed polymer. The tested samples showed a reduction in dielectric constant than that of solid PEI but at a higher loading, it showed a higher value due to threshold percolation and a reduction in thermal conductivity was observed for foamed PEI. From thermogravimetric analysis, we can conclude that PEI with 3% filler loading showed better thermal stability compared to other PEI foam compositions.