Abstract
By combining advanced imaging tools with morphology-based numerical modelling, a methodology has been proposed to measure the wood-adhesive bond performance at the micro level. Through this integration of multi-modal and multi-scale tools, this methodology provides a tool to understand the complex interactions between wood and adhesive phases at a microscale. Focusing all measurements and modelling on matched physical specimens avoided many simplifying assumptions. Direct measurement of strain development validated that the model was capable of representing the effects of cellular structure and adhesive penetration. With this measurement tool one can analyse stress and strain distribution patterns throughout adhesively bonded materials and virtually experiment with a range of variables like adhesive properties, wood species, compression levels, processing parameters, penetration patters, etc.
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