Determination of Elemental Content in Solder Mask Samples Used in Printed Circuit Boards Using Different Spectroanalytical Techniques

Abstract

Solder masks are essential materials used in the manufacture of printed circuit boards (PCB). This material protects PCBs against several types of damage and performance failure. In this study, the capabilities of laser-induced breakdown spectroscopy (LIBS) were investigated for the direct analysis of solder masks typically commercialized for homemade PCB production, and inductively coupled plasma–optical emission spectrometry (ICP-OES) was used to obtain a chemical profile for the target analytes Al, As, Ba, Cd, Co, Cr, Cu, Fe, Hg, Mg, Mn, Ni, Pb, Sb, Sn, and Zn. Inductively coupled plasma–mass spectrometry (ICP-MS) was also employed for the determination of potentially toxic elements, such as As, Cd, Cr, Pb, and Hg. In addition to the qualitative information that may be useful for obtaining the spectral profile related to the raw materials present in solder masks formulations, LIBS was also applied for major elements (Al, Ba, Cu, Fe, Mg, and Zn) determination, but due to the low sensitivity, the obtained results were only semi-quantitative for Ba. Regarding Cd, Cr, Hg, and Pb, the samples analyzed were following the restriction of hazardous substances (RoHS) directive of the European Union.

Keywords

Laser-induced breakdown spectroscopy LIBS solder mask printed circuit board PCB inductively coupled plasma–optical emission spectrometry ICP-OES inductively coupled plasma–mass spectrometry ICP-MS

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References

Yang

Z.-G.

Synthesis of Low Viscosity, Fast UV Curing Solder Resist Based on Epoxy Resin for Ink-Jet Printing”. J. Appl. Polym. Sci. 2013. 129(1): 187–192.

Hang Yu

R.F.H.

Zhang

Wong

de Rosa

I.M.

et al.

“Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging”. In: Mittal

K.L.

Ahsan

(eds). Adhesion in Microelectronics, 1st ed. Hoboken, NJ: Wiley-Scrivener, 2014, pp. 137–172.

Hofmeister

Maass

Fladung

Mayer

“Evaluation of Process Influences on Surface Chemistry of Epoxy Acrylate Based Solder Mask via XPS, ToF-SIMS and Contact Angle Measurement”. Mater. Chem. Phys. 2017. 185: 129–136.

Camp

C.A.

“Solder Masks”. In: Dostal

C.A.

(ed). Electronic Materials Handbook: Packaging, Volume 1, Materials Park, OH: CRC Press, 1989, pp. 553–560.

Chen

W.-H.

Chiang

K.-N.

Lin

S.-R.

“Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages”. J. Electron. Packag. 2002. 124(1): 37–44.

Matynia

Kutyłkea

Bukat

Pieńkowska

“The Properties of Soldering Mask Hardened by Means of UV Using Acrylate and Methacrylate Oligomers”. J. Appl. Polym. Sci. 1995. 55(11): 1583–1588.

Sun

Jiang

“Study on Properties of a Novel Photosensitive Polysiloxane Urethane Acrylate for Solder Mask”. J. Appl. Polym. Sci. 2010. 116(5): 3035–3039.

H. Zhu, Y. Guo, W. Li, A.A. Tseng, et al. Micro-Mechanical Characterizations of Solder Mask Materials. Proceedings of the Third Electronics Packaging Technology Conference. Singapore: December 7, 2000. Pp. 148–153.

X. He, M.H. Azarian, M.G. Pecht. “A Study of the Effect of Solder Mask on Electrochemical Migration of Printed Circuit Board”. Proceedings of the IPC Apex Conference, Volume 2. Las Vegas, NV: April 2010. Pp. 1297.

10.

IPC, the Association Connecting Electronics Industries. IPC-HDBK-840 Solder Mask Handbook. Bannockburn, IL: IPC, 2006. http://www.ipc.org/TOC/IPC-HDBK-840.pdf [accessed 12 April 2018].

11.

IPC, the Association Connecting Electronics Industries. IPC SM-840E. Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials. Bannockburn, IL: IPC, 2006. http://shop.ipc.org/IPC-SM-840E-English-D [accessed 12 April 2018].

12.

Wenk

K.S.

Ehrlich

“Allergic Contact Dermatitis from Epoxy Resin in Solder Mask Coating in an Individual Working with Printed Circuit Boards”. Dermatitis. 2010. 21(5): 288–291.

13.

Snyder

R.W.

Fuerniss

S.J.

“ATR/IR Spectroscopic Method for Following Photo-Polymer Curing”. Appl. Spectrosc. 1992. 46(7): 1113–1116.

14.

Hahn

D.W.

Omenetto

“Laser-Induced Breakdown Spectroscopy (LIBS), Part II: Review of Instrumental and Methodological Approaches to Material Analysis and Applications to Different Fields”. Appl. Spectrosc. 2012. 66(4): 347–419.

15.

Ciucci

Corsi

Palleschi

Rastelli

et al.

“New Procedure for Quantitative Elemental Analysis by Laser-Induced Plasma Spectroscopy”. Appl. Spectrosc. 1999. 53(8): 960–964.

16.

Pořízka

Klus

Hrdlička

Vrábel

et al.

“Impact of Laser-Induced Breakdown Spectroscopy Data Normalization on Multivariate Classification Accuracy”. J. Anal. At. Spectrom. 2017. 32(2): 277–288.

17.

Castro

J.P.

Pereira-Filho

E.R.

“Twelve Different Types of Data Normalization for the Proposition of Classification, Univariate and Multivariate Regression Models for the Direct Analyses of Alloys by Laser-Induced Breakdown Spectroscopy (LIBS)”. J. Anal. At. Spectrom. 2016. 31: 2005–2014.

18.

Zorov

N.B.

Gorbatenko

A.A.

Labutin

T.A.

Popov

A.M.

“A Review of Normalization Techniques in Analytical Atomic Spectrometry with Laser Sampling: From Single to Multivariate Correction”. Spectrochim. Acta B Atom. Spectros. 2010. 65(8): 642–657.

19.

Sperança

M.A.

Pomares-Alfonso

M.S.

Pereira-Filho

E.R.

“Analysis of Cuban Nickeliferous Minerals by Laser-Induced Breakdown Spectroscopy (LIBS): Non-Conventional Sample Preparation of Powder Samples”. Anal. Methods. 2018. 10: 533–540.

20.

Galbács

“A Critical Review of Recent Progress in Analytical Laser-Induced Breakdown Spectroscopy”. Anal. Bioanal. Chem. 2015. 407(25): 7537–7562.

21.

Berghof Products and Instruments. Microwave Digestion Technology: Application Report Speedwave Four v.8.0. https://www.berghof-instruments.com/en/downloads/ [accessed 12 April 2018].

22.

Dunn

Yen

T.F.

“Dissolution of Barium Sulfate Scale Deposits by Chelating Agents”. Environ. Sci. Technol. 1999. 33(16): 2821–2824.

23.

Andrade

D.F.

Pereira-Filho

E.R.

“Direct Determination of Contaminants and Major and Minor Nutrients in Solid Fertilizers Using Laser-Induced Breakdown Spectroscopy (LIBS)”. J. Agric. Food Chem. 2016. 64(41): 7890–7898.

24.

M. Woolley. “Corrosives on a PCB: Finding the Source”. EDN Network. 2013. https://www.edn.com/design/pc-board/4422894/Corrosives-on-a-PCB–Finding-the-source [accessed 12 April 2018].

25.

A. Matsumura, K. Ishikawa. Production of Solder Masked Electric Circuit Boards. US5181984 A. Filed 1991. Issued 1993.

26.

R.R. Rohloff. Solder Mask Composition. US4252888A. Filed 1980. Issued 1981.

27.

J.A. Serenson Jr, S. Marongelli. “The Effect of Solder Mask and Surface Mount Adhesive Types on a PCB Manufacturing Process”. Proceedings of the Technical Program (West and East), National Electronic Packaging and Production Conference, Volume 2. 1999. Pp. 731–746. http://www3.uic.com/wcms/Images.nsf/(GraphicLib)/Effect_of_Solder_Mask.PDF/$file/Effect_of_Solder_Mask.PDF [accessed 12 April 2018].

28.

Wypych

Handbook of Fillers, 2nd ed. Toronto: ChemTec Publishing, 1999.

29.

Gul

Islam

Yasin

Mir

“Flame-Retardant Synergism of Sepiolite and Magnesium Hydroxide in a Linear Low-Density Polyethylene Composite”. J. Appl. Polym. Sci. 2011. 121(5): 2772–2777.

30.

de Harrington

P.B.

Kolbrich

Cline

“Experimental Design and Multiplexed Modeling Using Titrimetry and Spreadsheets”. J. Chem. Educ. 2002. 79(7): 863.

31.

Aquino

F.W.B.

Paranhos

C.M.

Pereira-Filho

E.R.

“Method for the Production of Acrylonitrile–Butadiene–Styrene (ABS) and Polycarbonate (PC)/ABS Standards for Direct Sb Determination in Plastics from e-Waste Using Laser-Induced Breakdown Spectroscopy”. J. Anal. At. Spectrom. 2016. 31: 1228–1233.

32.

Taurino

Cannio

Mafredini

Pozzi

“An Efficient and Fast Analytical Procedure for the Bromine Determination in Waste Electrical and Electronic Equipment Plastics”. Environ. Technol. 2014. 35(24): 3147–3152.

33.

European Commission. “Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment”. Off. J. Eur. Union. 2011. 54: 88–110.