This paper highlights the thermal properties of copper–diamond composites fabricated by field assisted sintering technology. The samples were fabricated using a matrix of copper alloyed with silver and zirconium. Previous reports have shown that these samples possess high thermal conductivity. This work examines the thermal conductivity of the samples after being subjected to thermal cycling. Coefficient of thermal expansion is also reported in this work.
ZwebenC. Advances in high-performance thermal management materials – a review. J Adv Mater2007; 39: 3–10.
2.
ChuRCSimonsREEllsworthMJ. Review of cooling technologies for computer products. IEEE Trans Device Mater Reliab2004; 4: 568–585.
3.
AbyzovAMKidalovSVShakhovFM. High thermal conductivity composite of diamond particles with tungsten coating in a copper matrix for heat sink application. Appl Therm Eng2012; 48: 72–80. DOI: 10.1016/j.applthermaleng.2012.04.063.
4.
ChenC. Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method. Rare Metals2011; 30: 408–413.
5.
ZhangY. Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles. Scr Mater2011; 65: 1097–1100.
6.
SchubertTCiupinskiLZielinskiW. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications. Scr Mater2008; 58: 263–266.
7.
Stoessel C. High thermal conductivity graphite copper composites with diamond coatings for thermal management packaging applications. In: MRS proceedings, 1995, pp.147–152, Pittsburgh: Materials Research Society.
8.
ChuK. Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles. J Alloys Comp2010; 490: 453–458.
9.
RapeALiuXKulkarniA. Alloy development for highly conductive thermal management materials using copper diamond composites fabricated by field assisted sintering technology. J Mater Sci2013; 48: 1262–1267.
10.
ChuK. On the thermal conductivity of CuZr/diamond composites. Mater Design2013; 45: 36–42.
11.
SinhaVSpowartJ. Influence of interfacial carbide layer characteristics on thermal properties of copper-diamond composite. J Mater Sci2013; 48: 1330–1341.
12.
ZhangXGuoHYinF. Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications. Rare Metals2011; 30: 94–98.
