Effects of interface bonding on the corona resistance of the polyimide/nano-Al 2 O 3 three-layer composite films

Abstract

Polyimides (PIs) are widely used in many fields including aerospace and microelectronics. Due to their poor corona resistance, their practical applications were limited, especially in the field of variable frequency motors. In this study, we have achieved for the first time to increase the corona resistance by controlling the preparation process of the three-layered PI composite. A series of PI/nano-Al₂O₃ composite films with novel three-layer structure were prepared by in situ polymerization employing pyromellitic dianhydride and 4,4-diaminodiphenyl as raw material, N,N-dimethylacetamide as solvent, and doping of nano-Al₂O₃. The first layer of the PI/Al₂O₃ composite film was characterized by Fourier transform infrared spectroscopy, and the imidization rate under different processes was calculated. The interface structures and bonding conditions of the composite films were characterized by scanning electron microscope, and the surface morphologies of the composite films treated by different corona-resistance times were investigated. X-ray diffraction analysis was also used to study the effect of nano-Al₂O₃ on PIs with different imidization ratios. The corona-resistance time and breakdown field strength of the composite films prepared by different processes were also tested. The results indicated that the combination of the three-layer composite film and the corona-resistance abilities of the composite membrane surface was enhanced by increasing the imidization rate. Meanwhile, the corona-resistance time and the electrical breakdown strength of composite films were also improved by increasing the imidization rate.

Keywords

Polyimide corona resistance imidization process

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