Novel fluorine-containing polyimides were synthesized through copolymerization by using 2,3,3′,4′-biphenyltetracarboxylic dianhydride (α-BPDA) and 4,4′-(4,4′-isopropydenediphenox-y) bis-(phthalic anhydride) (BPADA) as dianhydrides and 4,4′-oxydianiline (ODA) and 2,2 - Bis [4-(4-aminophenoxy)phenyl]-hexafluoropropanane (HFBAPP) as diamines. Noncoplanar structure, flexible ether bond, and trifluoromethyl give the polyimide good thermoplastic, solubility, and heat resistance. The glass transition temperatures of polyimide films are 232.5°C∼262.2°C, the 5% weight loss temperatures are 521.5°C∼531.0°C, and the residual mass is more than 50% as heating to 800°C. With the increase of HFBAPP content in diamine, the dielectric constant of the material decreases from 3.21 to 2.78, and the dielectric loss decreases from 0.00962 to 0.00687 at 1 MHz, which greatly improves the dielectric properties of the material.
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