Effects of new ionic liquids on mechanical properties and thermal conductivity of PC/ABS composites

According to the structural characteristics of PC/ABS containing benzene rings, an imidazole ionic liquid [MTMSiIM]H₂PO₂ was synthesized. [MTMSiIM]H₂PO₂ served as the modifier for modifying G powder via ball milling to produce ionic liquid functional graphene (Si-G). Si-G was utilized as a thermal conductive filler to investigate its impact on the mechanical properties and thermal conductivity network formation of PC/ABS composites. During the melt blending process, the imidazole group of Si-G and the benzene ring in PC/ABS form a π-π interaction. This interaction enhances the dispersion of Si-G in PC/ABS and strengthens the interface interaction between the two. As a result, it improves the mechanical properties and thermal conductivity of PC/ABS composites. Experimental results indicate that when 11 wt% of Si-G is added, the tensile strength of the composites is 63.05 MPa, marking a 9.4% and 4.5% increase compared to PC/ABS and G powder/PC/ABS, respectively. Furthermore, the flexural modulus of the 11 wt% Si-G/PC/ABS composites is 3495.37 MPa, showing a 65.5% and 5.7% improvement over PC/ABS and G powder/PC/ABS, respectively. Moreover, the 11 wt% Si-G/PC/ABS composites exhibit the highest thermal conductivity at 0.488 W·m⁻¹ K⁻¹, which is 103.7% and 10.4% higher than that of PC/ABS and G powder/PC/ABS, respectively.