Silicon wafers are widely used in integrated circuits. This article addresses an important aspect of flat wafer grinding: grinder design. An advanced grinder with two-spindle and three-workstation for ø300 mm silicon wafer based on the principles of in-feed grinding was successfully developed. A mathematical model on topography control was developed for the first time to provide a totally integrated solution for dressing chuck with given topography. The developed model was then applied to predict the chuck topography or to adjust the obliquity adjustment device according to the parameters of ground chuck. Finally, the pilot experiments on two groups of chucks, which demonstrate the correctness of topography control are included.
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