Evaluation of thermal characteristics of laser induced heating of microfilm in relation to printed circuit board manufacturing

The emerging field of microelectronics has expeditiously developed over recent decades, owing to the development of novel materials and state-of-the-art fabrication technologies, as it offers crucial solutions to specific and complicated challenges. Laser systems are effectively utilized in material processing applications due to their inherent capabilities that provide rapid, quality and flexibility to reduce production costs involved. Microelectronics manufacturing basically comprises circuit boards (printed circuit boards), semiconductor, IC wafers are a few applications where laser system has been employed over traditional manufacturing technologies. In the viewpoint of the importance of the application of laser in the arena of microelectronics, the present research work is dedicated to evaluate the thermal characteristics developed in laser heating of microfilm (printed circuit board). During the operation of laser heating on the substrate surface, the quantity of material removal is largely dependent on the high temperature induced by the laser. The parametric laser-substrate interaction phenomena are the prime deciding factor for the successful accomplishment of the manufacturing operation. From the literature review, it has been observed that not much concentration has been given to the application of non-Fourier’s model though it is specifically suited for microscale heat transfer. This research paper theoretically investigates the thermal characteristics (peak temperature, temperature distribution curvature, pulse time, optical penetration depth, time of laser exposure, laser absorption radius and so on) by employing non-Fourier’s heat conduction model with pulse laser heat source. The theoretical estimation will be validated by the existing experimental research outcomes. The present research paper might be an asset for deciding the design of process variables and protocols in terms of laser-based manufacturing in the arena of microelectronics.