Abstract
Amide-containing bismaleimide (ACBI) resins were prepared using four monomeric reactants: 3,4'-oxydianiline (3,4'-ODA), trimellitic anhydride (TMA), maleic anhydride (MA), and 4-aminobenzoic acid. Their chemical structures were characterized using elemental analysis and FTIR. The peel strength, dielectric constant, dissipation factor, heat resistance, and chemical resistance were studied. The experimental results show that the optimal hot-press conditions for ACBI/copper foil laminates was 320 °C and 4.9 MPa. The ACBI laminates treating with 0.2% NZ97 coupling agent had the highest peel strength of 2.097 kN/m. The peel strength was 1.568 kN/m after 24 h at 300 °C. The 1 MHz dielectric constant of ACBI was 3.48, and the dissipation factor was 0.0082. After a hot/wet treatment (steam at 100 °C) for 72h, ACBI laminates maintained 76% of their original peel strength. After treating in 10% H2SO4 solution at 60°C for 30 minutes, ACBI laminates maintained 88% of their original peel strength.