Curing of epoxy adhesives between thin metal foils by means of inductive heating

Abstract

Metal foils are being widely used, from the chemical or electronics sector to household appliances. The joining of these foils by adhesive bonding is often the preferred method due to discolouring and warping under the thermal stresses of other joining methods, such as welding. However, long curing times are a disadvantage of adhesive bonding compared to welding. The use of electromagnetic induction is a promising solution for accelerated curing. This work investigates induction heating for accelerated curing of 1-C epoxy adhesives for bonding of thin nickel foils. Process parameters for rapid curing of the adhesives were determined based on reaction kinetics using differential scanning calorimetry measurements. According to those results peel test specimens were fabricated, and the peel resistance was evaluated using a 90° peel load.

Keywords

Polymers metallic materials materials testing materials design non-metals production

Get full access to this article

View all access options for this article.

References

Luo

Rao

, et al. Advances and Innovations in Ferronickel-Making. Singapore: Springer Nature Singapore; Imprint Springer, 2023.

Wall

Martinez

Vandenavyle

. Corrosion behavior of a structural nickel electrodeposit. Microsyst Technol 2005; 11: 319–330.

El-Sayed

A-R

Mohran

Abd El-Lateef

. Corrosion study of zinc, nickel, and zinc-nickel alloys in alkaline solutions by Tafel Plot and impedance techniques. Metallurgical Mater Trans A 2012; 43: 619–632.

Romero

Herranz

Morales

. Study of magnetoelastic properties of pure nickel parts produced by metal injection moulding. Mater Des 2015; 88: 438–445.

Grote

K-H

. Dubbel: Taschenbuch Für Den Maschinenbau. Berlin, Heidelberg: Springer Berlin / Heidelberg, 2014.

Hermann

Chaudhuri

Spagnol

. Bipolar plates for PEM fuel cells: a review. Int J Hydrogen Energy 2005; 30: 1297–1302.

Petrova

Lukina

Isaev

. Epoxy adhesives and their application. Polym Sci, Ser D 2020; 13: 245–249.

Matsumura

Tanoue

Atsuta

. Adhesive bonding of stainless steels and their component metals. J Oral Rehabil 2000; 27: 1054–1059.

Voß

Kaufmann

Vallée

. Curie-supported accelerated curing by means of inductive heating Part I – model building // curie-supported accelerated curing by means of inductive heating – part II validation and numerical studies. J Adhes 2022; 98: 2045–2077.

10.

Rudnev

Cook

Loveless

. Handbook of induction heating. Boca Raton, FL: CRC Press Taylor & Francis Group, 2017.

11.

Carbas

RJC

da Silva

LFM

Critchlow

. Adhesively bonded functionally graded joints by induction heating. Int J Adhes Adhes 2014; 48: 110–118.

12.

Stein

. Rapid adhesive bonding and field repair of aerospace materials. NASA Reports, NASA Langley Research Center Hampton, VA, USA, 1985.

13.

Stein

Tyeryar

Hodges

. Rapid adhesive bonding concepts. NASA Reports, NASA Langley Research Center Hampton, VA, USA, 1 June 1984. https://ntrs.nasa.gov/citations/19840021899.

14.

Mahdi

Kim

H-J

Gama

, et al. A comparison of oven-cured and induction-cured adhesively bonded composite joints. J Compos Mater 2003; 37: 519–542.

15.

Kothe

Ratsch

Lammel

, et al. Thermo-accelerated curing of transparent glass-glass bondings through in-situ heat generation in the adhesive joint. J Adhes 2023; 1-23.

16.

Voß

Evers

Vallée

. Low-temperature curing of adhesives – large-scale experiments. J Adhes 2023; 99: 817–852.

17.

Carbas

RJC

da Silva

Critchlow

. Effect of post-cure on adhesively bonded functionally graded joints by induction heating. Proc IMechE, Part L: J Materials: Design and Applications 2015; 229: 419–430.

18.

Sourour

Kamal

. Differential scanning calorimetry of epoxy cure: isothermal cure kinetics. Thermochim Acta 1976; 14: 41–59.

19.

Roşu

Caşcaval

Mustątǎ

, et al. Cure kinetics of epoxy resins studied by non-isothermal DSC data. Thermochim Acta 2002; 383: 119–127.

20.

Hardis

Jessop

Peters

, et al. Cure kinetics characterization and monitoring of an epoxy resin using DSC. Raman spectroscopy, and DEA. Composites, Part A 2013; 49: 100–108.

21.

Thanki

Parsania

. Dynamic DSC curing kinetics and thermogravimetric study of epoxy resin of 9,9′-bis(4-hydroxyphenyl)anthrone-10. J Therm Anal Calorim 2017; 130: 2145–2156.