Integration of one-dimensional nanostructures with microsystems: an overview

<title/>

The current state of solutions provided for the issue of integration between micro- and nanoscales is reviewed for the specific case of nanowires and nanotubes. Such structures serve as field emitters, transistors or laser sources, digits for manipulation and handling, as sensing elements or as agents for the modification of surface properties such as the adhesive strength. However, it is noteworthy that the majority of reported device work remains confined to component level prototype development without the prospect of full scale system integration due to the lack of batch compatible fabrication and processing techniques. On the one hand, nanostructures made by self-assembly do not possess a high level of control on their orientation and numbers, and hence, their interfacing and integration with a microsystem pose difficulties. On the other hand, top-down approaches such as manipulation, serial deposition and high resolution lithographic techniques do not satisfy the needs of large scale fabrication due to their expensive and/or non-parallel working principles. These techniques along with hybrid approaches taking advantage of the structural control of self-assembly and geometric control of high resolution lithography will be discussed and major applications will be highlighted to shed light on the capabilities and limitations associated with each process.