Soldering experiments of chip scale package devices were carried out by means of diode laser soldering system with Sn–Ag–Cu solders. In addition, pull tests and a scanning electron microscope were used to analyse the effect of processing parameters on mechanical strength of solder joints. Viscoplastic finite element simulation was utilised to predict solder joint reliability for different package geometry under accelerated temperature cycling conditions. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed soldering time, an optimal power and package geometry exists, while the optimal mechanical properties of microjoints are gained.
WangTH, LeeCC, LaiYS, HuangCE: ‘Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages’,Electron. Manuf. Technol. Sympos., 2004, 56, 26–30.
9.
AmagaiM: ‘Chip scale package (CSP) solder joint reliability and modeling’, Proc. 36th Int. Reliability Physics Symp., Reno, NV, USA, March–April 1998, IEEE, 260–268.
10.
MoritaY, ArakawaK, TodoM: ‘Experimental and numerical analysis of thermal deformation of electronic packages, QFP and MCM’,J. Exp. Mech., 2006, 21, (1), 11–15.
11.
DarveauxR, BanejiK, MawerA, DodyG: ‘Reliability of plastic ball grid array assembly’, in‘Ball grid array technology’, (ed. , LauJ, ed), 379–442; 1995, New York, McGraw-Hill.
12.
SuganumaK, NingXS: ‘Effect of diode-laser parameters on shear force of micro-joints soldered with Sn–Ag–Cu lead-free solder on Au/Ni/Cu pad lead-free soldring technology’,Trans. Nonferr. Met. Soc. China, 2006, 16, (6), 1374–1378.
13.
ZahnBA: ‘Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package’, Proc. IEEE/CPMT Int. Electronics Manufacturing Technology (IEMT) Symp., San Jose, CA, USA, July 2002, IEEE, 274–284.
14.
ZahnBA: ‘Comprehensive solder fatigue and thermal characterization of a silicon based multi-chip module package utilizing finite element analysis methodologies’, Proc. 9th Int. ANSYS Conf., Pittsburgh, PA, USA, August 2000, ANSYS.
15.
KimKS, HuhSH, SuganumaK: ‘Effect of triethanolamine and heliotropin on cathodic polarization of weakly acidic baths and properties of Sn–Ag–Cu alloy electrodeposits’,Electrochim. Acta., 2008, 53, (5), 2637–2643.
16.
HanZJ, XueSB, WangJX, ZhangX, ZhangL, YuSL, WangH: ‘Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology’,Trans. Nonferr. Met. Soc. China, 2008, 18, (4), 814–818.
17.
YangLY, BernsteinJB: ‘Failure rate estimation of known failure mechanisms of electronic packages’,Microelectron. Reliab., 2009, 49, 1563–1572.
