Aging treatment was implemented for the Sn2·5Ag0·7Cu0·1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0·1Ni aged solder joint, the maximum growth activation energies of (Cu,Ni)6Sn5 and Cu3Sn are 86·8 and 93·7 kJ mol−1 respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder.
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