Abstract
Tests were performed to assess the feasibility of bonding single crystal silicon to copper and aluminium nitride. The application of the bonded component is in a cryocooled monochromator for synchrotron X-ray optics. Aluminium, gold and indium–silver interlayers were tried. Some bonded components were tested by immersion in liquid nitrogen to simulate cooling of the component in service. Although bonds could be formed, they were of insufficient integrity for use in a challenging cryogenic application.
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