Surface topography and sputtering behaviour of Cu–6Ag and Cu–1OSn in different plasma atmospheres

The surface topography of Cu–6Ag and Cu–10Sn (wt-%) solid solution binary alloys was studied after treatment in different plasma atmospheres. Scanning electron microscopy was used to examine the surfaces of the treated specimens and some topographical features were then observed, namely etch pits, well defined and cratered cones, redeposition of sputtered material, and grain boundaries. It was found that Ag in Cu–Ag increased the alloy's overall sputtering yield whereas Sn reduced the sputtering yield of the Cu–Sn alloy.