The joint copper-alumina obtained at a solidification condition of Cu/Cu2O eutectic was studied. Experiments involved many different techniques, such as scanning electron microscopy (SEM), X-ray diffractometry, X-ray microanalysis, and transmission electron microscopy (TEM). It was observed that a thin inhomogeneous interfacial layer is present between Cu and Al2O3 ceramics and it consists of two sublayers: the first is nanocrystalline complex oxide CuAlO2. This layer changes progressively into a crystalline CuAl2O4 sublayer. A model of liquid phase bonding between copper and alumina is proposed.
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