A new approach is introduced to refine the analysis for the chip energy in the highefficiency deep grinding process, by considering the heat partitioning at the chip formation area. The analysis for the chip-work subsystem has been combined with the whole thermal system to derive the grinding temperature on the workpiece surface. The variation of chip temperature with material removal rate under different grinding conditions was investigated, and the relationship between the chip temperature and workpiece contact temperature was derived. The grinding temperatures obtained using different approaches were compared with ‘measured temperatures’, estimated from the depth of thermal damage observed on ground samples.
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