Vibration characteristics of the capillary in ultrasonic wire bonders

Abstract

Currently ultrasonic wire bonders with precision capillary tips are widely used in the packaging industry for bonding wires to ICs and circuits. However, the quality and strength of a bond are affected significantly by the vibration of the bonding capillary. It is, therefore, necessary to study the vibration characteristics of the capillary for better understanding and for developing a non-perturbative and low-cost monitoring device for improving bonding quality control. In this paper, the vibration characteristics of the capillary are presented in terms of natural frequency and vibration modes using finite-element models. The predicted displacement profile along the capillary is compared with the measurement using a non-contact laser interferometer. In general, a good agreement between the prediction and measurement is obtained, and it shows that the interferometer may be a good monitoring tool for characterization of capillary tip vibration, as well as providing a reference for other monitoring devices.