Abstract
A thin stiff film subjected a compressive force on a compliant substrate can form wrinkles. Buckling stiff piezoelectric thin films hold great applications for micro- and nano-electromechanical systems. The present study focuses on the buckling process of a piezoelectric thin film bonded to a compliant layer, which in turn lies on a rigid support. Nonlinear electromechanical equations for the buckling of a thin piezoelectric plate are employed to model the piezoelectric film poled in the thickness direction. By solving the boundary value problem, the critical buckling condition and the wavelength of the buckles for substrates of various moduli and the thicknesses are obtained and discussed. The effect of piezoelectricity on the critical buckling condition of piezoelectric film is examined. It is found that the piezoelectricity has a stiffening effect, which is not negligible.