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chuck dressing
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Select article: Research on topography control of two-spindle and three-workstation wafer grinder
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Research article
First published September, 2011
Research on topography control of two-spindle and three-workstation wafer grinder
X L Zhu,
R K Kang,
G Feng
[...]
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Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science
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Select article: The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim
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Research article
First published October, 2021
The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim
Xianglong Zhu,
Weihua Yao
,
Xiaoguang Guo
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Advances in Mechanical Engineering
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