An investigation of nanoindentation tests on the single crystal copper thin film via an atomic force microscope and molecular dynamics simulation

Abstract

Nanoindentation tests performed in an atomic force microscope have been utilized to directly measure the mechanical properties of single crystal metal thin films fabricated by the vacuum vapour deposition technique. Nanoindentation tests were conducted at various indentation depths to study the effect of indentation depths on the mechanical properties of thin films. The results were interpreted by using the Oliver-Pharr method with which direct observation and measurement of the contact area are not required. The elastic modulus of the single crystal copper film at various indentation depths was determined as 67.0 > 6.9 GPa on average, which is in reasonable agreement with the results reported by others. The indentation hardness constantly increases with decreasing indentation depth, indicating a strong size effect. In addition to the experimental work, a three-dimensional nanoindentation model of molecular dynamics (MD) simulations with embedded atom method (EAM) potential is proposed to elucidate the mechanics and mechanisms of nanoindentation of thin films from the atomistic point of view. MD simulations results show that due to the size effect no distinct dislocations were observed in the plastic deformation processes of the single crystal copper thin films, which is significantly different from the plastic deformation mechanism in bulk materials.