Super-insulation materials have become more commonplace as highly insulated building envelopes are required to reduce the energy demand of buildings aligned with the net zero targets. While several super insulation materials are available, their environmental impacts and practical on-site limitations hindered their large-scale adoption. The following paper investigates the feasibility of developing hollow-core vacuum insulated panels supported by an internal structural array with different configurations. The designed panel was simulated and measured to evaluate its performance as a thermal insulator for building applications. Panel samples were manufactured from polished stainless-steel plates separated by a PTFE structural array. The change in temperature and heat flux through the sample was measured in a vacuum chamber at a pressure of 0.01 Pa. Thermal conductance was obtained from gradual measurements of heat flux and temperature across the sample after a rapid increase in temperature. Numerical methods that combine molecular and macroscopic solvers were used to model unsteady behaviour recorded in empirical tests. Direct Simulation Monte Carlo (DSMC) was used to calculate the thermal conductivity of the rarefied gas, which was then used to solve the enthalpy equation for the multi-region model. Thermal resistance from empirical tests and numerical methods are in agreement within error bands, the greatest accuracy observed in high conductance models. Thermal resistance as low as 0.17 m 2 · K · W − 1 and as high as 4.75 m 2 · K · W − 1 was measured. Low conductance sample configurations were sensitive to thermal contact conductance from the structural array contact interfaces, accounting for at least 40% of transferred energy. Gas conduction at a pressure of 0.01 Pa transfers up to 4% of energy in low emissivity sample configurations. Radiative energy transfer in high conductance configurations was responsible for up to 95% of transferred energy. The paper provides a comprehensive feasibility study, providing a solid foundation for further design optimization of the technology.